Solder Paste Printing
This is the first step where solder paste is applied to the board. A stencil is used to apply the paste only on the parts where components will be mounted.
SPI
SPI checks the printing volume, flatness, height, volume, area, and height deviation of the solder paste. This is done after solder paste printing (Sharpening) offset, defect damage.
SMT assembly
Electronic components are placed on the PCB. This step requires precision as components must align with the solder paste.
Reflow Soldering
After placement, the board passes through a reflow oven where the solder paste melts and solidifies, forming a solid solder joint between the components and the board.
Through-Hole Assembly
For PCBs requiring through-hole components, these are inserted in this step